Wafer Bump & Wire Bonding 3D AOI
▶ Highest quality 3D Wire-Inspection.
▶ With high-resolution, complete inspection is possible even
▶ Inspect Mirror-surface without Reflection problem.
▶ As for PEMTRON'S unique optical technology,
Coaxial lighting was applied to 3D installation.
▶ All Packages including
SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.
▶ AOI + SPI Multi-Hybrid System.
▶ With high resolution quality, inspection of small and dense parts such as
Bump, Mini LED, parts lower than 009004, etc. are optimized.