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Wafer Bump 3D Vision Inspection

Semiconductor

8800WI

Wafer Bump 3D Vision Inspection

▶ Conduct with PASS Buffer when REWORK Part with Multiple NGs
▶ Function to start manufacturing with the REWORK Parts during
    INSPECTION ATM Check
▶ Apply the LOAD PORT substitute loading system during UNLOADER PART
    ATM inspection
▶ AIR CHUCK Works on Both 8-inch(200mm), 12inch(300mm) WAFER
▶ Users can output and monitor the designated DATA by Using the
    self-developed SPC SW, such as data, defective images,
    and charts.
▶ PEMTRON SMARTRON server system allows user to view and control each
    device through one operation PC to monitoring the
    operational status and SPC DATA of all equipment
▶ Using 3D Inspection Methodology to process the BUMP Inspection
▶ Reduce resources to check and debug the fault defects based on the
    outstanding inspection precision

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