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Wafer Bump & Wire Bonding 3D AOI

Semiconductor

ZEUS

3D Wafer Bump & Wire Bonding AOI Inspection system

▶ Highest quality 3D Wire-Inspection.
▶ With high-resolution, complete inspection is possible even
    for Foot-shape.
▶ Inspect Mirror-surface without Reflection problem.
▶ As for PEMTRON'S unique optical technology,
    Coaxial lighting was applied to 3D installation.
▶ All Packages including
    SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.
▶ AOI + SPI Multi-Hybrid System.
▶ With high resolution quality, inspection of small and dense parts such as
    Bump, Mini LED, parts lower than 009004, etc. are optimized.

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